"Life moves pretty fast, if you don't stop and look around once in a while, you could miss it."
- Ferris Bueller
-Led redesign of magnetometer’s 6 channel PC104 DC-DC power supply for UofA space physics research lab.
- Personally solved issues of start-up through soft-start capacitors, of switching regulators not entering PWM mode
from improperly set up sync-pulse and when using inverting buck-boost topology for negative outputs by adding
a level-shift circuit, inability of group members to set up functioning IBB converters and negative linear regulators,
and solely finalized the key sub-circuit inductor/capacitor/switching frequency values of final design.
- Worked first-hand on drafting Requirements/Specifications document from client’s input, parts list and BOM,
bi-monthly progress reports, prototyping stage on breadboard/PCB, MCU programming, and final report.
- Designed and built a custom fuzz guitar pedal which takes input sine waves from electric guitar
pickup and outputs square-esque waves with volume, tone, and sustain control.
- This included parts selection, fine-tuning of schematic for preferred sound through breadboard prototyping and
LTspice simulations, custom PCB design, and assembly.
- Solved issues of transistors not turning on by increasing base voltage to ~0.7V by decreasing C-B resistance; and
lack of gain in volume transistor by increasing the ratio of C:E resistors
- Independently led team collecting field data in live plant for assessment of EHT (Electric Heat Tracing)
system, the creation of 40+ new drawings,
quality checked all drawings and prepared results/report for
client myself and assisted in client meetings.
-Shown is the installed electric heat trace for one of client's vessels, designed myself.
- 240V Input, 3 Circuits, RTD control, Thermon HTSX 15-2 Cable for this specific vessel.
-Independently led entire design of EHT circuits and deliverables for 11 Vessels total.
-2 main microfabrication projects completed in the UofA nanoFAB clean room.
-1st where a P-type silicon wafer was processed to create working multi-layer structures such as Via Chains, Greek/Kelvin Crosses, and Serpentine Resistors.
-2nd Wafer was a P-type SOI wafer processed to achieve functioning MEMS devices such as Comb drives, spiral drives, beams, and micro-grippers.
-Integrated circuit design lab consisted of several projects ranging from fully custom design and layout (NOT(AB+C) Chip) and largely automated design/layout using tools with manual connections (8x8 Multiplier) completed using Cadence Virtuoso. DRC and LVS verified.
-10 State design consisted of state diagram creation, button/switch/7-segment display mapping in constraint file, VHDL coding, simulation and verification in Vivado, and synthesis of final design onto Xilinx FPGA.
